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大學(xué)生新聞網(wǎng),大學(xué)生新聞發(fā)布平臺
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出國人員英文簡歷表格

出國人員英文簡歷表格(一)

Name   Sex   photo
birthday   Height  
native place   nationality  
membership   School  
curriculum vitae   Major  
Tel   Email  
Postal Code   Address  
self intro  

 
hobbies  

 
demonstrate

 
work
experience
 

 


 

  出國人員英文簡歷表格(二)

Name:xuexila Hukou: 
Residency:Shanghai Work Experience:
Current Salary: Tel:
E-mail:xuexila.com
Career Objective
Desired Industry: Electronics/Semiconductor/IC 
Desired Position: IC Design/Application Engineer ,Semiconductor Technology
Desired address: Shanghai ,Jiangsu  Desired Salary: Negotiable
Work Experience
2005/12—Present ***Company
  Industry: Electronics/Semiconductor/IC
Diffusion Process Engineer 
Responsibilities:
  1. Qualify new equipments & products.
  2. Establish new process recipes.
  3. Co work with PIE to handle relative WAT fails cases, and provide preventive action.
  4. Co work with EE to deal with inline defect case, and optimize it.
  5. SPC Project maintenance & optimization.
  6. Operation introduction development.
2003/08—2005/11 HuaYue micro electric company LTD.
  Industry: Electronics/Semiconductor/IC
Implant Process Engineer 
Responsibilities:
  1. New Implant process recipe establishment.
  2. Perform FAB product plan.
  3. Co work with PIE&PDE to deal with PCM fails issues.
  4. Co work with EE to maintain Implant equipments to produce smoothly and effectively.
  5. Daily monitor SPC Project maintenance & optimization.
Education and Training
1999/09—2003/08 Hefei University of Technology
Electronic Science And Technology        Bachelor
Professional Skills
Language Skills: English: VERY GOOD
Certificate: 2001/09  CET4

  出國人員英文簡歷表格(三)

Name:xuexila Hukou: 
Residency:  Work Experience: 
Current Salary:  Tel: 
E-mail:xuexila.com
Career Objective
Desired Industry: Electronics/Semiconductor/IC 
Desired Position: IC Design/Application Engineer
Desired address: Shanghai ,Beijing ,Shenzhen Desired Salary: ¥10,000-14,999/Month
Work Experience
2003/02—Present ***Company
  Industry: Electronics/Semiconductor/IC
R&D IC Design/Application Engineer 
Responsibilities:
Analog circuits design include CMOS Operational Amplifiers design, Switched Capacitor circuits, clock detecting, clock design, bandgap, PLL, power on reset etc Attend system design use matlab and verify the data from hspice using matlab digital synthesis using Synopsys_DC, timing analysis, Formality, create circuit framework, P&R using Apollo Interaction with layout designer for analog circuit’s layout.
2001/02—2003/02 STATE Microelectronics Co. LTD
  Industry: Electronics/Semiconductor/IC
R&D IC Design/Application Engineer 
Responsibilities:
Create model of unit, circuit analysis and simulation, writing test coding, chip testing Study IC design tools: hspice star_sim verilog_XL NCverilog Synopsys Design Compiler/Analyzer etc Study Computer architecture.
2000/07—2001/02 LianShun(DaLian) Microelectronics Co. Limited
  Industry: Electronics/Semiconductor/IC
R&D IC Design/Application Engineer 
Responsibilities:
Practice in IC foundry for 2 months; Study drawing layout、circuit simulation 、writing program use verilog Participate in designing the chip for music.
Education and Training
1996/09—2000/07 Hunan University   Microelectronics    Bachelor
  Circuit; Analog/digital/high frequency electronics technique; HW and interface of computer; Programming of ASM; C programming; IC theory; IC application; Microelectronic devices; Transistor theory ; Semiconductor Physics , Professional physical ,theory and application of sensor, Theory of TV etc
Professional Skills
Language Skills: English GOOD
Self-appraisal
Aspire to employ new ideas, concepts, methods and technologies Energetic and self-motivated team player Excellent communication, interpersonal, and leadership skills Thrive in both independent and collaborative work environments.
    作者:大學(xué)生新聞網(wǎng)    來源:大學(xué)生新聞網(wǎng)
    發(fā)布時間:2024-10-31    閱讀:
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